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The AMD Kria™ K26 system-on-module (SOM) is a compact embedded platform that integrates a custom-built AMD Zynq™ UltraScale+™ MPSoC that runs optimally (and exclusively) on the K26 SOM with DDR memory, nonvolatile storage devices, a security module, and an aluminum thermal heat spreader. The SOM is designed to be plugged into a carrier card with solution-specific peripherals. Key target applications include smart city, machine vision, industrial robotics, and AI/ML computing. The following figure shows the top-side and bottomside connector view.
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The K26 SOM leverages the XCK26-SFVC784-2LV-C/I, a custom-built Zynq UltraScale+ MPSoC that runs
optimally (and exclusively) on the SOM. It provides an embedded processing system (PS) with tightly integrated
programmable logic and a rich set of configurable I/O capabilities. The SOM hardware features include:
• Zynq UltraScale+ MPSoC (XCK26 in commercial (C) grade or industrial (I) grade)
• 4 GB 64-bit wide, 2400 Mb/s memory
• Integrated non-volatile memory devices
○ 512 Mb QSPI
○ 16 GB eMMC
○ 64 Kb EEPROM
• TPM2.0 security module
• Two 240-pin connectors with access to user-configurable I/O:
○ PS MIO
○ PS-GTR transceivers
○ PS I2C platform control bus
○ PL HPIO
○ PL HDIO
○ PL GTH transceivers
○ Sideband platform signals
○ Power and power sequencing signals
• Integrated and flexible power design
○ SOC power supplies derived from a single +5V input
○ PL I/O supplies customized through carrier card defined power rails
• Compact mechanical size with integrated thermal heat spreader
The following sections provide a more detailed description of:
• Functional interfaces and input/output
• MPSoC processing system (PS)
• MPSoC programmable logic (PL)
• Boot sources and storage devices
• Security features and module
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